Copper-plated catalytic - how to put metal on plastic.

Publish date: 2017-01-26

The catalytic copper plating method is a process that enables the metallization of non-metallic surfaces, including dielectrics and even plastic. The process consists in sputtering the prepared dielectric surface with two working solutions A and B. The previously activated surface is covered with copper as a result of its reduction when the working liquids A and B meet on the copper-plated surface. Reduction takes place only on the activated and previously prepared work surface. Activation can be done, for example, with palladium. The purpose of activating, sensitizing the surface of the plastic is to deposit small amounts of precious metal on it. The palladium isolated in this way is a catalyst in the chemical copper plating process. The applied copper coating can be the basis for further processing, e.g. galvanic copper plating. The galvanic copper plating process is much more efficient and enables the application of much thicker layers of metal. Unfortunately, electroplating is not possible on non-conductive surfaces.
Sensitization can be done, for example, in a palladium salt solution with the following composition:

- Distilled water (pure) 1 l
- Palladium (II) chloride (pure) 0.2 g/l
- Hydrochloric acid (pure) (d=1.19) 10 ml/l

After activation, the item should be thoroughly cleaned by rinsing it in distilled water and then, very carefully, rinse it in cold running water for at least a minute. Trying to ensure that the water reaches the entire surface that is to be subjected to the metallization process.

The object prepared in this way can be subjected to the copper plating process using working baths with the following composition:

Working liquid A:

- Distilled water 1 liter
- Copper (II) sulfate (pentahydrate) 35 g/l

- Sulfuric acid (VI) (d=1.84) 50 ml/l

Working fluid B:

- Distilled water 1 liter
- Sodium phosphite (hypophosphite) (monohydrate) 50 g/l
The working liquids are applied to the prepared surface by giving two volume parts of the working liquid A to one volume part of the working liquid B. Working liquids A and B should be applied from two independently spraying nozzles of the guns for chemical plating and they should meet only on the copper-plated surface. The temperature of the applied liquid should be 80 degrees Celsius.

Catalytic copper plating can also be performed in baths that do not require elevated working temperatures and application by spraying.
An example of such a bath, efficient at room temperature, is also a two-component bath:

Working liquid A:

- Distilled water 1 liter
- Copper (II) sulphate (pentahydrate) 35 g/l
- Sodium and potassium tartrate 170 g/l
- Sodium hydroxide 50 g/l

Working fluid B:

- Formaldehyde (40% solution)

For five parts by volume of working liquid A, we use one part of working liquid B. Copper plating is carried out by immersing the workpiece in the bath for 15-30 minutes. For items sensitive to etching, the bath can be diluted without compromising its working properties with distilled water in a ratio of 1:1 or 1:3.
Unfortunately, both copper plating baths are characterized by low stability. Stabilizers are available on the market, but their composition and influence on the process are a secret of the manufacturer.

Copper sulfate , sodium hydroxide , hydrochloric acid and distilled water available at distripark.com .

Szlaczek

*This article is for informational purposes only. The presented description, in particular the use of the products, is exemplary and constitutes non-binding information about the characteristics and possibilities of their use/application. In any case, before using the product, consult a specialist whether the specific use is safe and justified. We do not bear any responsibility for the use of the proposed solutions, even in very similar situations.